We supply thermally enhanced organic BGA that is our distinctive product and has achieved satisfactory results.
Features
1．High heat release characteristics; thermal resistance 12℃/W
(Size: 42.5mm square,
Air
velocity: 0m/s)
2．Accuracy for mount position of substrate and heat sink; less than 100μm
3．Support heat release structure; with heat sink
Applications
CPU and others
Specifications
1. Wire bond type, face down cavity structure
2. Number of layers; two to four layers
3. Number of pins; 500 to 750 (Package size: 42.5mm square)
4. Lamination; pin lamination method by pre-preg
Structure of cross section
Tie-bar less
Features
1. Wiring design work is easy because of tie-bar less structure.
2. Electricity test of matrix BGA is available.
3. Original technology by SMI-ED (USP6, 249, 053)
Flow of work-process
Copyright 2003 Sumitomo Metal (SMI) Electronics Devices Inc. All Rights Reserved.
