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Multi pin lead type package with heat slug
Multi pin lead type package with heat slug

BGA type package, BGA type package with heat slug
BGA type package, BGA type package with heat slug

1-Port Simulation Model
1-Port Simulation Model

Millimeter wave package actually measured(○; simulation area) Millimeter wave package actually measured(○; simulation area)		 This is a device package to support ubiquitous network and we provide our superior design ready for radio frequency.
Features
  1. Broad band and high transmission characteristic; DC to 77GHz, -1dB to 77GHz
  2. Ready for surface mounting; BGA structure, lead terminal structure (DC to 40GHz)
  3. Provision for heat release; with heat slug
  4. High reliability; hermetic seal

Applications [Millimeter wave communication package]
V-SAT, LMDS, FWA, W-LAN, communication between cars, home link, etc.
[Optical communication, Electronic device package]
OC192, OC768, and others
Specifications
  1. Koplena wave guide type via structure
  2. This package uses laminated alumina. (W electrode + Au/Ni plating)
  3. Ribbon/Wire type, BGA/Lead type [In the time of secondary mounting]
  4. Seal by Kovar ring + Kovar rid and ceramic cap
  5. Ready for cavity (depth>0.1mm:in the case of ceramic base)
  6. Others, Structural design to meet required specifications is available.
Examples of structural design by 3D electromagnetic field simulation
　 1-Port transmission characteristic (Simulation)


1-Port transmission characteristic (Actually measured data)

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