DCB appearance photography DCB appearance photography(Ni electroplating specification) Features By joining copper circuit board directly onto ceramic substrate, these products have both characteristics of high thermal & electrical conductivity in copper and high electric insulation in ceramics. Applications Power module substrate (automobile, air conditioner, industrial robot, IH electric rice cooker, etc.) DCB substrate cross sectional structure Assembly image figure DCB design rule ZDA(High strength Alumina) Item Specification Ceramic substrate thickness (mm) Alumina: 0.32, 0.64 ZDA:0.25,0.32 AIN:0.64,0.80(under development) Ceramic substrate size (mm) 15×15 〜 130×180 Ceramic substrate tolerance (mm) ±0.6%(mold formed), ±0.1mm(Laser worked) DCB substrate camber 0.1mm/inch Cu plate thickness (mm) 0.20,0.25,0.30,0.40,0.50??0.60 (under development) Pattern tolerance (mm) ±0.3(pre etching spec.) ±0.1 (after etching spec) Pattern width (mm) 1.0min(pre etching) After etching is variable according to Cu thickness. 0.35min. in Cu thickness 0.2mm Pattern space (mm) 0.8min.(pre etching spec.)  0.3min.(after etching spec) Tolerance between ceramic substrate edge and Cu plate edge ±0.5 Copyright 2003 Sumitomo Metal (SMI) Electronics Devices Inc. All Rights Reserved.