Sumitomo Metal (SMI) Electronics Device Inc.

Evaluation equipment and simulator

Field	Characteristics	Evaluation equipment	Evaluation item	Simulator	Analysis technology
Strength	Reliability	Loading equipment	Strength measurement	・ANSYS(FEM) * Note1	・Elasticity, elasto-plasticity analysis ・Stationary, nonstationary (transient) analysis ・Creeping analysis <Analysis results> ・Cause investigation of stress rupture ・Proposition of package material, size ・Forecast of solder fatigue ・Forecast of seam weld fracture
		Heat cycle test equipment	Reliability
	Destructive analysis	Reliability equipmentScanning: Scanning electron microscope	・Appearance and cross section observation of crack ・Fracture surface observation(investigation of fracture origin)

Heat	Heat dissipation	Thermal resistance measurement equipment (9 sets)	Thermal resistance	・ANSYS(FEM) * Note1	・Stationary and non stationary thermal transmission analysis <Analysis results> ・Proposition of package material, size ・Forecast of chip allowable heat output ・Proposition of heat dissipation structure
	Temperature distribution	Thermograph (infrared camera)	Temperature measurement

*Note 1: ANSYS is the registered trademark of US ANSYS company.