| Fatigue analysis of solder joint part at BGA
assembly |
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According to the ambient temperature change and depending on
the solder shape, the strain of solder joint point is generated and it affects
largely the product life. Therefore the solder shape that is most effective
to extend the product life shall be considered.
The figures below show the results of the strain depending on the temperature
change for different solder shapes. The most small strain is obtained by model-A
and could obtain the value of about half of that of model-C. |
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Model-A |
Model-B |
Model-C |
| Shape of solder joint |
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Strain distribution
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| Stress vector distribution |
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