 |
| Input-output terminal cross talk analysis of SAW filter package |
 |
| It is possible to investigate the cross talk (signal
leakage) between input-output terminal of SAW filter package using 3 dimensional
electromagnetic analysis. |
 |
| Analysis example of electromagnetic
field strength distribution |
| Item |
Type
A |
Type
B |
Type
C |
| Conductor pattern on assembly face of SAW filter chip |
 |
 |
 |
Electrical field strength under assembly face of SAW filter chip (frequency 4.5GHz)
Red: large field strength
Green: middle field strength
Blue: small field strength |
 |
 |
 |
Magnetic field strength under assembly face of SAW filter chip (frequency 4.5GHz)
Red: large field strength
Green: middle field strength
Blue: small field strength |
 |
 |
 |
| Content |
|
Input output terminal position change |
Addition of GND via |
|
 |