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| Ceramic package |
Communication package (for SAW filter, Crystal resonator/Oscillator) CMOS / CCD, MEMS package, DIP package, CQFP, Matching Lid, Microwave package, Optical communication package, RF power device package, LED package |
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| Functional circuit-board/Electronics functional products |
Press molding ceramics products, DCB, Aluminum nitride, RF components/materials, Noise filter gSEMIFILTh, Piezoelectric components/materials |
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