Ceramic package CSP, BGA, MCM, Communication package (for SAW filter, Crystal resonator/Oscillator), DIP package, CQFP, Matching grid, Microwave package, Optical communication package, RF power device package Organic package Plastic package (PBGA) Functional circuit-board/Electronics functional products Thick-film hybrid system (Cu, Ag), Alumina substrate for thick-film, Alumina substrate for thin-film, Press molding ceramics products, DCB, Aluminum nitride, RF components/materials, Noise filter “SEMIFILT”, Piezoelectric components/materials Copyright 2003 Sumitomo Metal (SMI) Electronics Devices Inc. All Rights Reserved.